适用于 PCB 制造、射频硬件、新能源汽车、工业控制和高可靠性电子产品。
选型参数
询价时需要明确哪些信息
该表用于询价前的品类级选型准备。具体数值需结合最终型号、规格书和项目工况确认。
| 技术参数 | 常见取值/选项 | 询价需提供 | 工程备注 |
|---|---|---|---|
| 材料体系 | FR-4, High-Tg FR-4, Halogen-free FR-4, Polyimide, PTFE ceramic-filled laminate, Hydrocarbon ceramic laminate, IMS metal-core laminate | Target resin system, IPC slash sheet, dielectric target and thermal class. | Material selection affects dielectric behavior, thermal reliability, process window and cost. |
| 产品形态 | Copper-clad laminate (CCL), Prepreg, Bondply, Resin-coated copper (RCC), Metal-core laminate | CCL or prepreg type, sheet/roll format, panel size and intended stack-up position. | Separate core, prepreg and bonding material requirements for multilayer builds. |
| 介电常数 Dk | Low-Dk high-speed grades, RF/microwave Dk classes, Frequency-specific datasheet values | Target Dk, test frequency, test method and controlled-impedance requirement. | Dk varies by frequency, resin system and test method; use data near the operating frequency. |
| 介质损耗 Df | Standard-loss FR-4, Mid-loss, Low-loss, Ultra-low-loss RF/high-speed grades | Maximum Df, operating frequency, insertion-loss target and signal speed. | Df is a primary driver of high-speed and RF transmission loss. |
| 玻璃化转变温度 Tg | Standard Tg, High Tg, Ultra-high Tg | Required Tg class, soldering profile, number of lead-free reflow cycles and service temperature. | Tg indicates the resin transition region; reliability also depends on Td, CTE and moisture absorption. |
| 热分解温度 Td | Td at 5% weight loss, Lead-free assembly compatible grades | Minimum Td requirement and expected assembly/rework exposure. | Td is critical for lead-free assembly and thermal survivability. |
| Z 轴热膨胀系数 CTE | Below Tg CTE, Above Tg CTE, Total Z-axis expansion | Via reliability requirement, board thickness, layer count and thermal-cycle profile. | Lower Z-axis expansion helps reduce plated-through-hole fatigue in high-reliability boards. |
| 铜箔类型与铜厚 | ED copper, Rolled copper, RTF/VLP/HVLP copper, 0.5 oz, 1 oz, 2 oz | Copper type, copper weight, roughness requirement and finished copper thickness. | Low-profile copper reduces conductor loss in high-speed and RF designs. |
| 板材/芯板厚度 | 0.05-3.2 mm class, Custom core thickness, Prepreg ply combinations | Core thickness, tolerance, panel size and stack-up drawing if available. | Thickness tolerance affects impedance, mechanical stiffness and lamination yield. |
| 导热系数 | Standard FR-4, Thermally conductive dielectric, Metal-core IMS classes | Required W/mK class, heat-source power density and thermal path. | Use thermal materials when heat spreading or LED/power-device temperature rise is a design limit. |
| 阻燃等级 | UL 94 V-0, Halogen-free options, Application-specific fire safety requirements | Required flame rating, halogen-free requirement and target market. | Confirm exact certification status by material grade before public model claims. |
| 合规与认证 | RoHS, REACH, UL file information, IPC material data, Halogen-free declaration | Required compliance documents, destination market and customer audit requirements. | Compliance documents must match the exact grade, copper type and supplier lot where applicable. |
图库
该品类参考图片
订单支持
货运、付款和文件说明
FAQ